IEEE - Institute of Electrical and Electronics Engineers, Inc. - Full-Integrated power module for motor drive applications

2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)

Author(s): Qing Hua ; Zehong Li ; Bo Zhang ; Weizhong Chen ; Xiangjun Huang ; Dekai Cheng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2013
Conference Location: Kanazawa, Japan
Conference Date: 26 May 2013
Page(s): 289 - 292
ISBN (CD): 978-1-4673-5135-5
ISBN (Electronic): 978-1-4673-5136-2
ISBN (Paper): 978-1-4673-5134-8
ISSN (Paper): 1943-653X
DOI: 10.1109/ISPSD.2013.6694466
Regular:

This paper proposes an IGBT-based full-integrated power module (FIPM) that we have newly developed for compactness, high performance and low cost motor drive applications. It integrates all... View More

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