International Microelectronics Assembly and Packaging Society (IMAPS) - Holed packaging for mems sensors

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): Fulvio Fontana ; Kevin Formosa ; Giovanni Graziosi ; Mark Shaw ; Fabrizio Soglio ; Marco Tumiati
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 6
ISBN (Electronic): 978-2-9527-4671-7
Regular:

MEMS devices in consumer applications have expanded rapidly which is in part due to the use of the LGA package. This package technology gives the advantage of low cost small size and flexibility.... View More

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