International Microelectronics Assembly and Packaging Society (IMAPS) - A bottom-up approach to developing innovative resistive sensors

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): S. Behar ; B. Viallet ; J. Grisolia ; N. M. Sangeetha ; L. Ressier
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 5
ISBN (Electronic): 978-2-9527-4671-7
Regular:

Innovative, miniature-sized humidity sensors and strain gauges were realized from colloidal gold nanoparticle assemblies on rigid silicon and flexible polyimide substrates, fabricated by... View More

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