International Microelectronics Assembly and Packaging Society (IMAPS) - 3D TSV system in package (SiP) for aerospace applications

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): J. C. Riou ; E. Bailly ; C. Bunel ; L. Lenoir ; M. Pommier
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 7
ISBN (Electronic): 978-2-9527-4671-7
Regular:

In the frame of its future needs for aerospace market, Sagem has designed a 3D electronic function based on a TSV silicon interposer from IPDiA. This paper deals with motivations and technologies... View More

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