International Microelectronics Assembly and Packaging Society (IMAPS) - Thermal cycling of anisotropically conductive adhesive interconnections in demanding sensor applications

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): Sanna Lahokallio ; Anniina Parviainen ; Laura Frisk
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 6
ISBN (Electronic): 978-2-9527-4671-7
Regular:

Sensor components are increasingly used in electronic applications. One example of such a sensor is a humidity sensor. The attachment process of humidity sensors can be challenging as the sensor... View More

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