International Microelectronics Assembly and Packaging Society (IMAPS) - Thermoplastic packaging and embedding technology for ID-cards

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): Joao Marques ; Barbara Pahl ; Christine Kallmayer
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 5
ISBN (Electronic): 978-2-9527-4671-7
Regular:

State of the art ID-cards contain an RFID chip connected to a wired copper coil. For advanced smartcard applications the security-relevant data processing will be transferred from public terminals... View More

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