International Microelectronics Assembly and Packaging Society (IMAPS) - Electro-optical strength assessment of white LEDs multichip modules for automotive forward-lighting application: Failure analysis and packaging influence

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): B. Chambion ; L. Mendizabal ; L. Bechou ; A. Gasse ; Y. Deshayes ; V. Carreau
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 7
ISBN (Electronic): 978-2-9527-4671-7
Regular:

Performances of Lighting Emitting Diode (LED) are now suitable for automotive high beam / low beam lighting applications. Due to high brightness light sources needs in automotive, LEDs are... View More

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