International Microelectronics Assembly and Packaging Society (IMAPS) - Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): Louis-Michel Collin ; Luc G. Frechette ; Abdelkader Souifi ; Sandrine Lhostis ; Francois de Crecy ; Severine Cheramy ; Jean-Philippe Colonna ; Vincent Fiori
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 8
ISBN (Electronic): 978-2-9527-4671-7
Regular:

This work presents the impact of integrating microfluidic channels at different locations in a 3D stacked chip configuration to improve its thermal management. Bringing fluidic cooling within the... View More

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