International Microelectronics Assembly and Packaging Society (IMAPS) - Flex to flex bonding using anisotropic conductive film for imaging systems

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): K. Imenes ; H-V Nguyen ; A. Lifjeld ; T. Eggen ; C. E. Baumgartner ; K. E. Aasmundtveit
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 4
ISBN (Electronic): 978-2-9527-4671-7
Regular:

Bonding and integration technologies in ultrasound probes are challenging due to space limitations. Flexible substrates, with the benefits of being bendable, small and allows 3D integration, is an... View More

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