International Microelectronics Assembly and Packaging Society (IMAPS) - Assembly of high-aspect ratio optoelectronic sensor arrays on flexible substrates

2013 European Microelectronics Packaging Conference (EMPC)

Author(s): W. Bub ; F. Kraze ; A. Bruckner ; R. Leitel ; A. Mann ; A. Brauer
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Publication Date: 1 September 2013
Conference Location: Grenoble, France
Conference Date: 9 September 2013
Page(s): 1 - 6
ISBN (Electronic): 978-2-9527-4671-7
Regular:

Nowadays, most commercial optoelectronic sensor concepts are based on planar photodiode arrangements that originate from an integrated lithographic fabrication and include various filter... View More

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