IEEE - Institute of Electrical and Electronics Engineers, Inc. - An attempt to 3D Capon beamforming

2013 8th International Conference on Communications and Networking in China (CHINACOM)

Author(s): Jiaxiang Xu ; Jianhua Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2013
Conference Location: Guilin, China
Conference Date: 14 August 2013
Page(s): 734 - 739
ISBN (Electronic): 978-1-4799-1406-7
DOI: 10.1109/ChinaCom.2013.6694690
Regular:

With growing interest in three-dimensional (3D) beamforming, this paper analyzes the standard Capon method in the 3D case with a planar array configuration, in which the direction of arrival is... View More

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