IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructuring thermoresponsive gel using hysteresis towards 3D cell assembly

2013 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2013)

Author(s): Masaru Takeuchi ; Masahiro Nakajima ; Hirotaka Tajima ; Toshio Fukuda
Sponsor(s): IEEE Ind. Electron. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2013
Conference Location: Tokyo, Japan
Conference Date: 3 November 2013
Page(s): 1,537 - 1,542
ISSN (Paper): 2153-0858
DOI: 10.1109/IROS.2013.6696553
Regular:

In this paper, we conducted an assembly of microstructures made of a thermoresponsive gel using hysteresis character of the thermoresponsive polymer solution. This method can be used for 3... View More

Advertisement