IEEE - Institute of Electrical and Electronics Engineers, Inc. - Signal integrity factors in high speed multi-board test setup

2013 13th International Symposium on Communications and Information Technologies (ISCIT)

Author(s): Sandeep Dattaprasad ; Kyaw Swa Maung ; K. S. Lew ; Y. F. Lai ; M. Y. Chong ; Manoj Kumar Dey
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2013
Conference Location: Surat Thani, Thailand
Conference Date: 4 September 2013
Page(s): 276 - 281
ISBN (CD): 978-1-4673-5578-0
ISBN (Electronic): 978-1-4673-5580-3
DOI: 10.1109/ISCIT.2013.6645864
Regular:

There has been rapid improvement in mixed signal System on Chip (SoC) designs used in storage technologies with high-speed interfaces such as SATA 6G (Serial Advanced Technology Attachment), SAS... View More

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