IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias

2013 16th Euromicro Conference on Digital System Design

Author(s): Mostafa Said ; Farhad Mehdipour ; Mohamed El-Sayed
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2013
Conference Location: Los Alamitos, CA, USA
Conference Date: 4 September 2013
Page(s): 925 - 932
ISBN (Electronic): 978-1-4799-2978-8
DOI: 10.1109/DSD.2013.104
Regular:

Three-dimensional (3D) integration using through-silicon vias (TSVs) offers advantages over traditional 2D integration, however there are still several challenges originated from stacking dies.... View More

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