IEEE - Institute of Electrical and Electronics Engineers, Inc. - An electrical study of differential clock die-to-die interconnection in multi-chip packages

2013 5th Asia Symposium on Quality Electronic Design (ASQED)

Author(s): Tang Min Keen ; Tan Wei Jern
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2013
Conference Location: Penang, Malaysia
Conference Date: 26 August 2013
Page(s): 196 - 199
ISBN (CD): 978-1-4799-1312-1
ISBN (Electronic): 978-1-4799-1314-5
DOI: 10.1109/ASQED.2013.6643587
Regular:

This paper presents an electrical study on die-to-die interconnect, differential clock signals in MCPs. The paper seeks to tackle the issues caused by shorter and denser interconnection in... View More

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