IEEE - Institute of Electrical and Electronics Engineers, Inc. - Heterogeneous stacking of 3D MPSoC architecture: Physical implementation analysis and performance evaluation

2013 5th Asia Symposium on Quality Electronic Design (ASQED)

Author(s): Mohamad Hairol Jabbar ; Dominique Houzet ; Omar Hammami
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2013
Conference Location: Penang, Malaysia
Conference Date: 26 August 2013
Page(s): 127 - 135
ISBN (CD): 978-1-4799-1312-1
ISBN (Electronic): 978-1-4799-1314-5
DOI: 10.1109/ASQED.2013.6643575
Regular:

3D integration is one of the feasible technologies for producing advanced computing architecture to support ever-increasing demand of higher performance computing especially in mobile devices. The... View More

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