IEEE - Institute of Electrical and Electronics Engineers, Inc. - A haptic surface scanning and machining parallel manipulator for registration-free bone resurfacing during arthroplasty

2013 IEEE International Conference on Robotics and Automation (ICRA)

Author(s): I. Gertler ; Y. Shapiro ; A. Wolf
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2013
Conference Location: Karlsruhe, Germany
Conference Date: 6 May 2013
Page(s): 2,347 - 2,352
ISBN (Electronic): 978-1-4673-5643-5
ISBN (Paper): 978-1-4673-5641-1
ISSN (Paper): 1050-4729
DOI: 10.1109/ICRA.2013.6630895
Regular:

As orthopaedic implants become more sophisticated and complex, shaping the bone surface to match the implant becomes increasingly important. Accurate bone machining contributes to success of the... View More

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