IEEE - Institute of Electrical and Electronics Engineers, Inc. - A new method on Cu stress measurement by bandgap voltage reference circuit

2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC)

Author(s): Tan Chan Lik ; Tan Chun Keat ; Govindasamy Thilaga ; Cheng Chin Siong
Sponsor(s): IEEE Electron Devices Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2013
Conference Location: Hong Kong, China
Conference Date: 3 June 2013
Page(s): 1 - 2
ISBN (Electronic): 978-1-4673-2523-3
DOI: 10.1109/EDSSC.2013.6628233
Regular:

Cu metallization is not only used in low power logic circuit but also in high power automotive application because of its low resistance and robustness in repetitive clamping. How to characterize... View More

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