IEEE - Institute of Electrical and Electronics Engineers, Inc. - ShrinkWrap: Compiler-Enabled Optimization and Customization of Soft Memory Interconnects

2013 IEEE 21st Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)

Author(s): Eric S. Chung ; Michael K. Papamichael
Sponsor(s): IEEE Comput. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2013
Conference Location: Seattle, WA, USA
Conference Date: 28 April 2013
Page(s): 113 - 116
ISBN (Electronic): 978-0-7695-4969-9
ISBN (Paper): 978-1-4673-6005-0
DOI: 10.1109/FCCM.2013.56
Regular:

Today's FPGAs lack dedicated on-chip memory interconnects, requiring users to (1) rely on inefficient, general-purpose solutions, or (2) tediously create an application-specific memory... View More

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