IEEE - Institute of Electrical and Electronics Engineers, Inc. - Accurate Thermal-Profile Estimation and Validation for FPGA-Mapped Circuits

2013 IEEE 21st Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)

Author(s): Abdulazim Amouri ; Hussam Amrouch ; Thomas Ebi ; Jorg Henkel ; Mehdi Tahoori
Sponsor(s): IEEE Comput. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2013
Conference Location: Seattle, WA, USA
Conference Date: 28 April 2013
Page(s): 57 - 60
ISBN (Electronic): 978-0-7695-4969-9
ISBN (Paper): 978-1-4673-6005-0
DOI: 10.1109/FCCM.2013.48
Regular:

Accurate thermal profile estimation for FPGA, at design time, is necessary to avoid unexpected thermal hot-spots in the circuit before deploying the FPGA to the in-field operation. Both accurate... View More

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