IEEE - Institute of Electrical and Electronics Engineers, Inc. - Applying statistics to find the causes of variability in aluminum evaporation: a case study

Author(s): M. Aceves ; J.A. Hernandez ; R. Murphy
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 1992
Volume: 5
Page Count: 3
Page(s): 165 - 167
ISSN (Paper): 0894-6507
ISSN (Online): 1558-2345
DOI: 10.1109/66.136280
Regular:

A study of the causes of variability in the thickness of aluminum deposited on silicon wafers is presented. A work team was assembled to define and characterize the process, equipment, and... View More

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