IEEE - Institute of Electrical and Electronics Engineers, Inc. - Research of micro removing copper foil of FCCL assisted with laser

2011 IEEE International Conference on Mechatronics and Automation (ICMA)

Author(s): Jianwen Yuan ; Jimin Chen ; Chao He
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2011
Conference Location: Beijing, China, China
Conference Date: 7 August 2011
Page(s): 749 - 754
ISBN (CD): 978-1-4244-8114-9
ISBN (Electronic): 978-1-4244-8115-6
ISBN (Paper): 978-1-4244-8113-2
ISSN (CD): 2152-7431
ISSN (Paper): 2152-7431
DOI: 10.1109/ICMA.2011.5985755
Regular:

Flexible copper clad laminate (FCCL) mainly consists of conductive material (like copper foil) and insulated basilemma (such as PET). It is widely used in Flexible Printed Circuit (FPC) to produce... View More

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