IEEE - Institute of Electrical and Electronics Engineers, Inc. - Isolation techniques against substrate noise coupling utilizing through silicon via (TSV) for RF/mixed-signal SoCs

2011 Symposium on VLSI Circuits

Author(s): Uemura, S. ; Hiraoka, Y. ; Kai, T. ; Dosho, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2011
Conference Location: Kyoto, Japan, Japan
Conference Date: 15 June 2011
Page(s): 48 - 49
ISBN (CD): 978-4-86348-166-4
ISBN (Paper): 978-1-61284-175-5
ISSN (CD): 2158-5601
ISSN (Electronic): 2158-5636
ISSN (Paper): 2158-5601
Regular:

Isolation techniques against substrate noise coupling utilizing TSV processes are proposed. The TSV encloses the RF circuit on a SoC chip to improve the isolation between digital circuits and the... View More

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