IEEE - Institute of Electrical and Electronics Engineers, Inc. - Two free air convection and radiation thermal models for planar magnetic components

2011 IEEE 20th International Symposium on Industrial Electronics (ISIE)

Author(s): Kien Lai-Dac ; Lembeye, Y. ; Sarrazin, B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2011
Conference Location: Gdansk, Poland, Poland
Conference Date: 27 June 2011
Page(s): 456 - 461
ISBN (Electronic): 978-1-4244-9312-8
ISBN (Paper): 978-1-4244-9310-4
ISBN (Online): 978-1-4244-9311-1
ISSN (Paper): Pending
ISSN (Online): Pending
DOI: 10.1109/ISIE.2011.5984068
Regular:

Thermal is considered as a principal constraint in size reduction of passive components in power electronics. In fact, the maximum temperature rise of component must be kept under a limit that... View More

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