IEEE - Institute of Electrical and Electronics Engineers, Inc. - From 3D-SOC to 3D heterogeneous systems: Technology and applications

2011 IEEE Symposium on VLSI Technology

Author(s): Ancey, P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2011
Conference Location: Kyoto, Japan, Japan
Conference Date: 14 June 2011
Page(s): 180 - 181
ISBN (CD): 978-4-86348-166-4
ISBN (Paper): 978-1-4244-9949-6
ISSN (CD): 0743-1562
ISSN (Electronic): 2158-9682
ISSN (Paper): 0743-1562
Regular:

A wide range of requests coming from customer appears to demonstrate the feasibility of 3D Integration (3DI). The first industrial application is the CMOS Image Sensor. Medium to high density... View More

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