IEEE - Institute of Electrical and Electronics Engineers, Inc. - A technique for enhancing boiling heat transfer with application to cooling of electronic equipment

Author(s): S.M. You ; T.W. Simon ; A. Bar-Cohen
Sponsor(s): IEEE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 1992
Volume: 15
Page Count: 9
Page(s): 823 - 831
ISSN (Paper): 0148-6411
DOI: 10.1109/33.180048
Regular:

Particle layering is introduced as an effective and convenient technique for enhancing boiling nucleation on a surface. Because it can be applied without stress or damage to a surface, it may be... View More

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