IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling and analysis of grinding force in surface grinding

2011 IEEE International Conference on Computer Science and Automation Engineering (CSAE)

Author(s): Heran Yang ; Lei Zhang ; Daqi Li ; Tongzhan Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2011
Conference Location: Shanghai, China, China
Conference Date: 10 June 2011
Volume: 2
Page(s): 175 - 178
ISBN (CD): 978-1-4244-8726-4
ISBN (Electronic): 978-1-4244-8728-8
ISBN (Paper): 978-1-4244-8727-1
DOI: 10.1109/CSAE.2011.5952448
Regular:

A new simple model of grinding force in surface grinding is proposed in this paper. The model is based on the fact that the grinding forces are composed of chip formation force and sliding force.... View More

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