IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reduction of boiling thermal hysteresis in immersed electronics cooling on micro-configured graphite-metal conposite surfaces

2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications (ThETA)

Author(s): Wen-Jei Yang ; Nengli Zhang ; Chao, D.F. ; Shuichi, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2010
Conference Location: Cairo, Egypt, Egypt
Conference Date: 19 December 2010
Page(s): 433 - 436
ISBN (CD): 978-1-61284-266-0
ISBN (Electronic): 978-1-61284-267-7
ISBN (Paper): 978-1-61284-268-4
DOI: 10.1109/THETA.2010.5766427
Regular:

It is known that hysteresis is an important and unique dynamic characteristics in two-phase systems in motion with or without rotation. In pool boiling which generates vapor phase, the system is... View More

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