IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low silver, lead free solder paste, new alloy developments

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Author(s): Cucu, T.C. ; Plotog, I. ; Svasta, P. ; Branzei, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Pitesti, Romania, Romania
Conference Date: 23 September 2010
Page(s): 39 - 42
ISBN (CD): 978-1-4244-8122-4
ISBN (Electronic): 978-1-4244-8124-8
ISBN (Paper): 978-1-4244-8123-1
DOI: 10.1109/SIITME.2010.5651802
Regular:

The compliancy with RoHS directives as well as the trend towards green technologies and green processes has been the main driver for the paste manufacturers. One direction that has proven to be... View More

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