IEEE - Institute of Electrical and Electronics Engineers, Inc. - Biocompatibility assessment of advanced wafer-level based chip encapsulation

2010 3rd Electronic System-Integration Technology Conference (ESTC)

Author(s): Dy, E. ; Vos, R. ; Rip, J. ; la Manna, A. ; Op de Beeck, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Berlin, Germany, Germany
Conference Date: 13 September 2010
Page(s): 1 - 4
ISBN (Electronic): 978-1-4244-8555-0
ISBN (Paper): 978-1-4244-8553-6
ISBN (Online): 978-1-4244-8554-3
DOI: 10.1109/ESTC.2010.5642972
Regular:

Next generation implantable microsystem-based medical devices will have different packaging requirements than current implantable devices such as pace makers. While the packaging must remain... View More

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