IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel approach for reliability assurance of solder pastes against dew condensation

2010 3rd Electronic System-Integration Technology Conference (ESTC)

Author(s): Matzner, C. ; Rösch, M. ; Franke, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Berlin, Germany, Germany
Conference Date: 13 September 2010
Page(s): 1 - 4
ISBN (Electronic): 978-1-4244-8555-0
ISBN (Paper): 978-1-4244-8553-6
ISBN (Online): 978-1-4244-8554-3
DOI: 10.1109/ESTC.2010.5642878
Regular:

The advancing usage of electronic devices combined with a progressive trend to miniaturization sets high demands on reliability assurance. As complexity of systems and loads at mission locations... View More

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