IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel approach for reliability assurance of solder pastes against dew condensation
2010 3rd Electronic System-Integration Technology Conference (ESTC)
Author(s): | Matzner, C. ; Rösch, M. ; Franke, J. |
Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
Publication Date: | 1 September 2010 |
Conference Location: | Berlin, Germany, Germany |
Conference Date: | 13 September 2010 |
Page(s): | 1 - 4 |
ISBN (Electronic): | 978-1-4244-8555-0 |
ISBN (Paper): | 978-1-4244-8553-6 |
ISBN (Online): | 978-1-4244-8554-3 |
DOI: | 10.1109/ESTC.2010.5642878 |
Regular:
The advancing usage of electronic devices combined with a progressive trend to miniaturization sets high demands on reliability assurance. As complexity of systems and loads at mission locations... View More