IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructure and mechanical properties of laser ablation cleaned NiP platings for aluminum wire bonding

2010 3rd Electronic System-Integration Technology Conference (ESTC)

Author(s): Bennemann, S. ; Dresbach, C. ; Lorenz, G. ; Berthold, L. ; Petzold, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Berlin, Germany, Germany
Conference Date: 13 September 2010
Page(s): 1 - 5
ISBN (Electronic): 978-1-4244-8555-0
ISBN (Paper): 978-1-4244-8553-6
ISBN (Online): 978-1-4244-8554-3
DOI: 10.1109/ESTC.2010.5642852
Regular:

Aluminum wire bonding to nickel surfaces is often used in automotive applications. For assurance of a high quality contact a clean substrate without any contaminants is required. In this study... View More

Advertisement