IEEE - Institute of Electrical and Electronics Engineers, Inc. - Formation of mechanical strains in the component board of a high-end handheld product during shock impact

2010 3rd Electronic System-Integration Technology Conference (ESTC)

Author(s): Karppinen, J.S. ; Pakarinen, J. ; Li, J. ; Mattila, T.T. ; Paulasto-Kröckel, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Berlin, Germany, Germany
Conference Date: 13 September 2010
Page(s): 1 - 7
ISBN (Electronic): 978-1-4244-8555-0
ISBN (Paper): 978-1-4244-8553-6
ISBN (Online): 978-1-4244-8554-3
DOI: 10.1109/ESTC.2010.5642847
Regular:

The effect of mechanical shock impacts on electronic component boards is a key factor in the reliability of modern handheld products. Due to differences in product enclosures, impact orientations,... View More

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