IEEE - Institute of Electrical and Electronics Engineers, Inc. - Influence of metallographic preparation on EBSD characterization of Cu wire bonds

2010 3rd Electronic System-Integration Technology Conference (ESTC)

Author(s): Tkachenko, A. ; Mueller, M. ; Zerna, T. ; Wolter, K.-J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Berlin, Germany, Germany
Conference Date: 13 September 2010
Page(s): 1 - 5
ISBN (Electronic): 978-1-4244-8555-0
ISBN (Paper): 978-1-4244-8553-6
ISBN (Online): 978-1-4244-8554-3
DOI: 10.1109/ESTC.2010.5642846
Regular:

The advantages of copper wire bonding compared to gold wire bonding, such as lower material costs, have led to an increased interest in reliability of copper bonds. The knowledge of the bonded... View More

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