IEEE - Institute of Electrical and Electronics Engineers, Inc. - Applying Research on Creep Constitutive Model of LC4 Aluminium Alloy Based on BC-RBFNN

2010 International Conference on Multimedia Technology (ICMT)

Author(s): Min Yu ; Xianghua Peng ; Yingshe Luo ; Shuiping Yin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2010
Conference Location: Ningbo, China, China
Conference Date: 29 October 2010
Page(s): 1 - 4
ISBN (CD): 978-1-4244-7873-6
ISBN (Electronic): 978-1-4244-7874-3
ISBN (Paper): 978-1-4244-7871-2
DOI: 10.1109/ICMULT.2010.5629855
Regular:

creep is an extremely harmful phenomenon which can not be neglected at high temperature. As metal is increasingly used in high temperature structure, investigation on its creep at high temperature... View More

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