IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D Numerical Simulation of the Filling and Curing Stages in Epoxy Casting Process

2010 International Conference on Electrical and Control Engineering (ICECE)

Author(s): SaiJun Zhang ; Ning Yuan ; Feng Ruan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Wuhan, China, China
Conference Date: 25 June 2010
Page(s): 2,584 - 2,587
ISBN (CD): 978-0-7695-4031-3
ISBN (Electronic): 978-1-4244-6881-2
ISBN (Paper): 978-1-4244-6880-5
DOI: 10.1109/iCECE.2010.634
Regular:

This paper develops a 3-D numerical simulation model for the epoxy casting process including the filling and curing stages. A lot of factors are considered in the model, such as the resin flow,... View More

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