IEEE - Institute of Electrical and Electronics Engineers, Inc. - Impact Research of Process Parameters on Sink Index of Rapid Heat Cycle Molding Products

2010 International Conference on Electrical and Control Engineering (ICECE 2010)

Author(s): Sun Ling ; Liu Donglei
Sponsor(s): IEEE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Wuhan, China
Conference Date: 25 June 2010
Page(s): 2,793 - 2,796
ISBN (CD): 978-0-7695-4031-3
ISBN (Electronic): 978-1-4244-6881-2
ISBN (Paper): 978-1-4244-6880-5
DOI: 10.1109/iCECE.2010.682
Regular:

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