IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability Study on Absolute Pressure Sensitive Chip Vacuum Packaging

2010 International Conference on Electrical and Control Engineering (ICECE)

Author(s): Rongfeng Guan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Wuhan, China, China
Conference Date: 25 June 2010
Page(s): 1,542 - 1,545
ISBN (CD): 978-0-7695-4031-3
ISBN (Electronic): 978-1-4244-6881-2
ISBN (Paper): 978-1-4244-6880-5
DOI: 10.1109/iCECE.2010.380
Regular:

The anodic bonding technology has been widely utilized in the packaging of the microelectromechanical systems (MEMS), but its relatively high bonding temperature, sometimes relatively weak... View More

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