IEEE - Institute of Electrical and Electronics Engineers, Inc. - Research on Digital Image Correlation Method Applied in Shear Test of New Style Automotive Structural Adhesive

2010 International Conference on Electrical and Control Engineering (ICECE)

Author(s): Bin Li ; Guobiao Yang ; Qirong Zhu ; Fan Ni
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Wuhan, China, China
Conference Date: 25 June 2010
Page(s): 1,668 - 1,671
ISBN (CD): 978-0-7695-4031-3
ISBN (Electronic): 978-1-4244-6881-2
ISBN (Paper): 978-1-4244-6880-5
DOI: 10.1109/iCECE.2010.411
Regular:

In this paper, digital image correlation method (DICM) is employed to measure the shear behavior of the spot welding specimens and the ones using adhesive under quasi-static lap shear testing. The... View More

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