IEEE - Institute of Electrical and Electronics Engineers, Inc. - Research on techniques for 3D accurate modeling of soybean leaf

3rd International Congress on Image and Signal Processing (CISP 2010)

Author(s): QiuJu Xie ; ZhongBin Su
Sponsor(s): IEEE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2010
Conference Location: Yantai, China
Conference Date: 16 October 2010
Volume: 6
Page(s): 2,830 - 2,833
ISBN (CD): 978-1-4244-6515-6
ISBN (Electronic): 978-1-4244-6516-3
ISBN (Paper): 978-1-4244-6513-2
DOI: 10.1109/CISP.2010.5647338
Regular:

At present, although the shape of soybean leaves can be simulated, but the method of establishing leaves outline geometric features that provided in these studies was complex, the data volumes of... View More

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