IEEE - Institute of Electrical and Electronics Engineers, Inc. - Heterogeneously integrated InP/SOI laser using double tapered single-mode waveguides through adhesive die to wafer bonding

2010 7th IEEE International Conference on Group IV Photonics (GFP)

Author(s): Lamponi, M. ; Keyvaninia, S. ; Pommereau, F. ; Brenot, R. ; de Valicourt, G. ; Lelarge, F. ; Roelkens, G. ; Van Thourhout, D. ; Messaoudene, S. ; Fedeli, J.-M. ; Duan, G.-H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Beijing, China, China
Conference Date: 1 September 2010
Page(s): 22 - 24
ISBN (CD): 978-1-4244-6345-9
ISBN (Electronic): 978-1-4244-6346-6
ISBN (Paper): 978-1-4244-6344-2
DOI: 10.1109/GROUP4.2010.5643441
Regular:

An InP/Silicon hybrid laser based on double taper adiabatic mode transfer and BCB bonding is demonstrated, exhibiting nearly 1 mW output power at room temperature in pulsed operation regime. Such... View More

Advertisement