IEEE - Institute of Electrical and Electronics Engineers, Inc. - Pipeline-based interlayer bus structure for 3D networks-on-chip

2010 15th CSI International Symposium on Computer Architecture and Digital Systems (CADS)

Author(s): Daneshtalab, M. ; Ebrahimi, M. ; Liljeberg, P. ; Plosila, J. ; Tenhunen, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Tehran, Iran, Iran
Conference Date: 23 September 2010
Page(s): 35 - 41
ISBN (CD): 978-1-4244-6268-1
ISBN (Electronic): 978-1-4244-6269-8
ISBN (Paper): 978-1-4244-6267-4
DOI: 10.1109/CADS.2010.5623524
Regular:

The structure of direct vertical interconnections, called Through Silicon Vias (TSVs), is an important issue in the realm of 3D ICs. The bus-based and network-based structures are the two dominant... View More

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