IEEE - Institute of Electrical and Electronics Engineers, Inc. - Influence of connections as boundary conditions for the thermal design of PCB traces

2010 IEEE International Symposium on Industrial Electronics (ISIE 2010)

Author(s): Coppola, L. ; Agostini, B. ; Schmidt, R. ; Faria Barcelos, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2010
Conference Location: Bari, Italy, Italy
Conference Date: 4 July 2010
Page(s): 884 - 888
ISBN (CD): 978-1-4244-6391-6
ISBN (Electronic): 978-1-4244-6392-3
ISBN (Paper): 978-1-4244-6390-9
DOI: 10.1109/ISIE.2010.5637243
Regular:

The thermal design of a printed circuit board (PCB) requires a correct estimation of the temperature of each component that is part of it to guarantee the lifetime of the board. The literature... View More

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