IEEE - Institute of Electrical and Electronics Engineers, Inc. - Non-bias inspection of electrical failures in LSI interconnects using LTEM prototype system

2010 35th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2010)

Author(s): Yamashita, M. ; Otani, C. ; Matsumoto, T. ; Midoh, Y. ; Miura, K. ; Nikawa, K. ; Nakamae, K. ; Tonouchi, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Conference Location: Rome, Italy, Italy
Conference Date: 5 September 2010
Page(s): 1 - 2
ISBN (CD): 978-1-4244-6656-6
ISBN (Electronic): 978-1-4244-6657-3
ISBN (Paper): 978-1-4244-6655-9
DOI: 10.1109/ICIMW.2010.5612864
Regular:

Logic LSI chips fabricated by 180nm process were measured by a prototype system of the laser terahertz emission microscope (LTEM). By comparing the LTEM images between a normal circuit and a... View More

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