IEEE - Institute of Electrical and Electronics Engineers, Inc. - The experimental research of the non-brasive cryogenic polishing monocrystalline silicon wafer super-smooth surface

2010 International Conference on Computer, Mechatronics, Control and Electronic Engineering (CMCE 2010)

Author(s): Qu Shouping ; Zhang Zhongshu ; Liang Tianzhu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Changchun, China, China
Conference Date: 24 August 2010
Volume: 2
Page(s): 445 - 448
ISBN (CD): 978-1-4244-7955-9
ISBN (Electronic): 978-1-4244-7958-0
ISBN (Paper): 978-1-4244-7957-3
DOI: 10.1109/CMCE.2010.5610095
Regular:

Following the development of IC technology, the IC is developed as high density, high integration, and high-performance. It requires that the semiconductor materials should have super-smooth... View More

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