IEEE - Institute of Electrical and Electronics Engineers, Inc. - Vibration suppression for wafer transfer robot during trajectory tracking

2010 IEEE International Conference on Mechatronics and Automation (ICMA)

Author(s): Yanjie Liu ; Yumei Cao ; Lining Sun ; Xiaofei Zheng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 4 August 2010
Page(s): 741 - 746
ISBN (CD): 978-1-4244-5141-8
ISBN (Paper): 978-1-4244-5140-1
ISSN (CD): 2152-7431
ISSN (Electronic): 2152-744X
ISSN (Paper): 2152-7431
DOI: 10.1109/ICMA.2010.5589042
Regular:

In order to solve the vibration during the process of transferring wafers and achieve the purpose of transferring wafers accurately and stably, the wafer transfer robot dynamic model was modelled... View More

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