IEEE - Institute of Electrical and Electronics Engineers, Inc. - Optimization of multichip bonding on a SiOB platform for bidirectional optical subassembly using design of experiment

2010 15th OptoeElectronics and Communications Conference (OECC)

Author(s): Jung Woon Lim ; Sung Hwan Hwang ; Woo-Jin Lee ; Myung Jin Kim ; Seon Hoon Kim ; Swook Hann ; Jong-Sup Kim ; Boo-Gyoun Kim ; Byung Sup Rho
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2010
Conference Location: Sapporo, Japan, Japan
Conference Date: 5 July 2010
Page(s): 846 - 847
ISBN (CD): 978-4-88552-246-8
ISBN (Electronic): 978-4-88552-246-8
ISBN (Paper): 978-1-4244-6785-3
Regular:

We propose an assembly technique with optimum condition capable of performing high density multichip integration on a silicon optical bench platform using the design of experiment. We integrated... View More

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