IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electrical packaging characteristics of a 25-Gbit/s low-cost coaxial laser module

2010 15th OptoeElectronics and Communications Conference (OECC)

Author(s): Pei-Hao Tseng ; Tien-Tsorng Shih ; Hao-Wei Chen ; Yaw-Dong Wu ; Wood-Hi Cheng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2010
Conference Location: Sapporo, Japan, Japan
Conference Date: 5 July 2010
Page(s): 56 - 57
ISBN (CD): 978-4-88552-246-8
ISBN (Electronic): 978-4-88552-246-8
ISBN (Paper): 978-1-4244-6785-3
Regular:

An equivalent circuit model of a 25-Gbit/s coaxial laser module is built by extracting electrical characteristics of transistor outline (TO)-Can header, bonding wires, and load through ADS... View More

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