IEEE - Institute of Electrical and Electronics Engineers, Inc. - Through Co-design to optimize power delivery distribution system using embedded discrete decoupling capacitor

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Chen-Chao Wang ; Po-Chih Pan ; Hung-Hsiang Cheng ; Chi-Tsung Chiu ; Chih-Pin Hung
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 639 - 642
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583895
Regular:

As clock speeds increase into the gigahertz regime and rise times decrease into the pico-second regime, the interaction between capacitors and power/ground planes of a package, or board on which... View More

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