IEEE - Institute of Electrical and Electronics Engineers, Inc. - Factors affecting reliability of gold and copper in ball bonding

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Breach, C.D. ; Holliday, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 446 - 451
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583890
Regular:

Copper and gold ball bonds were bonded on 1.2µm thick Al-0.5%Cu-1%Si. One set of devices was aged at 175°C up to 1000 hours. A second set of devices was pre-conditioned for 168 hours at 85°C and... View More

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